Product Description
1. Semiconductor chips in line clean in packaging process.
2.Spray clean to remove flux and other contamination.
3. Long chemical wash+ Di water rinse+ Hot air dry process.
4. Wash liquid and rinse DI water add/discharge automatically.
5. Wash liquid spray pressure can adjust for different chips.
6. High flow amount and high pressure liquid for precise FC packaging chips.
7.DI water resistivity monitoring system.
8. Air blow+ Hot air dry system.
9. PLC control system, English interface and friendly operation system.
10.304 stainless steel frame structure.
11.SMEMA lines to connect up and down stream equipment.
12. Wash liquid concentration real time monitoring system.
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